SAT NANO Nano Tin Bismuth alloy powder SnBi alloy nanoparticle has a range of potential uses. Nano tin bismuth powder is widely used as solder and thermal componentsinfuses of electrical appliances, steam, fire protection, fire alarms and other devices. Nano Tin Bismuth alloy powder is available for 200-300nm,500nm, high purity 99.9% ration Sn42Bi58. Please feel free to check the specification
Nano tin-bismuth alloy powder possesses distinctive characteristics and is utilized in various applications. Here's an introduction to the features and uses of this material:
Characteristics:
1. Alloy composition: Nano tin-bismuth alloy powder is composed of tin and bismuth in the nanoscale range. The alloying of these elements results in unique properties not found in individual metals. The composition and structure of the alloy influence its characteristics.
2. Low melting point: Tin-bismuth alloys typically exhibit lower melting points compared to pure tin or bismuth. This property makes them suitable for applications where low-temperature processing or soldering is required.
3. Eutectic behavior: Tin-bismuth alloys often exhibit eutectic behavior, meaning they have a specific composition where the alloy mixture melts at a lower temperature than the individual components. This eutectic composition offers advantages in terms of phase behavior and alloy properties.
4. Biocompatibility: Tin-bismuth alloys, particularly those with high bismuth content, are known for their biocompatibility. This makes them suitable for use in biomedical applications, such as in implants, where compatibility with living tissues is essential.
Product name: Nano SnBi alloy (SnBi)
Particle size: 200-300nm, 300-500nm, 1-3um
Scale: Sn: Bi=42:58
Purity: 99.9%
Appearance: Dark gray
Morphology: Spherical
Packaging: Double layer anti-static sealed bag, 100g, 500g, 1kg per package or as required
Storage: Sealed in a cool and ventilated place, away from heat sources.
1. Soldering and electronics: Nano tin-bismuth alloy powder finds applications in soldering and electronics. Due to its low melting point and eutectic behavior, it is used as a lead-free solder in electronic components, circuit boards, and microelectronics. The alloy provides reliable bonding and enables the manufacturing of environmentally friendly solder materials.
2. Thermal management: The low melting point and thermal conductivity of tin-bismuth alloy make it useful in thermal management applications. It can be employed as a thermal interface material or solder to enhance heat transfer in electronic devices, such as CPUs, power modules, and LED lighting.
3. Biomedical applications: The biocompatibility of tin-bismuth alloys makes them suitable for biomedical applications. They can be used in medical implants, such as stents, as well as in biodegradable materials for temporary implants. The alloys' low toxicity and compatibility with biological systems are advantageous in these applications.
4. Alloys and composite materials: Tin-bismuth alloys are utilized as components in various alloy systems and composite materials. The addition of tin-bismuth alloy powder can improve the mechanical, electrical, or thermal properties of the base material, depending on the specific application.
5. Other applications: Nano tin-bismuth alloy powder may find application in other fields, such as energy storage, catalysts, and additive manufacturing, depending on its specific properties and characteristics.
The applications of nano tin-bismuth alloy powder continue to be explored and developed, and ongoing research contributes to expanding its potential uses and optimizing its properties for specific applications.
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